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Sandborn, Peter

Peter Sandborn
Keystone Professor
Mechanical Engineering
3127 Glenn L. Martin Hall

Research Interests 

  • Electronic packaging and reliability
  • Life-cycle cost analysis of electronic systems
  • System sustainment including: technology obsolescence management (DMSMS)
  • System availability
  • Supply chain management
  • Parts selection and management for electronic systems
  • Prognostics and health management (PHM) for electronic systems
  • Design for environment of electronic systems


  • Ph.D., University of Michigan, 1987

Honors and Awards 

  • IEEE Fellow (2014)
  • ASME Fellow (2013)
  • 2010 Visiting Fellow of the Royal Academy of Engineering (UK)
  • IEEE International Conference on Prognostics and Health Management 2011 Best Paper Award, for “Using Real Options to Manage Condition-Based Maintenance Enabled by PHM”
  • The Engineering Economist journal 2006 Best Paper Award, for “Obsolescence Driven Design Refresh Planning for Sustainment-Dominated Systems”
  • SOLE Proceedings Paper Award for best paper published during 2004 for "Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronics Systems”
  • 2009 Poole and Kent Teaching Award for Senior Faculty

Professional Memberships 

  • Invited Speaker: MIT, Virginia Tech, Georgia Tech, Chalmers University, Loughborough University, University of Bath, Cranfield University
  • Associate Editor: IEEE Transactions on Electronics Packaging Manufacturing
  • North American Editor of the International Journal of Performability Engineering
  • Board of Directors of the International PHM Society
  • Conference chair and program chair: ASME Design for Manufacturing and Life Cycle Conference
  • Program Committee: IEEE Multichip Module Conference
  • SIA CAD Tool roadmap, NEMI Passive Components Technology Working Group
  • Reviewer: IEEE Transactions on Electron Devices, IEEE Transactions on Circuits and Systems, IEEE Transactions on Components, Packaging, and Manufacturing Technology–Parts A, B, C, IEEE Transactions on VLSI, IEEE Design & Test of Computers, Journal of Industrial Ecology, Design Automation Conference (DAC), INTERpack Conference